| [1] | Shin Y., Hong S., Hur Y. C., et al. (2024). Damage-free dry transfer method using stress engineering for high-performance flexible two- and three-dimensional electronics. Nat. Mater. 23:1411−1420. DOI:10.1038/s41563-024-01931-y |
| [2] | Li A., Zhou W., Li H., et al. (2025). Drop-printing with dynamic stress release for conformal wrap of bioelectronic interfaces. Science 389:1127−1132. DOI:10.1126/science.adw6854 |
| [3] | Yunker P. J., Still T., Lohr M. A., et al. (2011). Suppression of the coffee-ring effect by shape-dependent capillary interactions. Nature 476:308−311. DOI:10.1038/nature10344 |
| [4] | Visser C. W., Kamperman T., Karbaat L. P., et al. (2018). In-air microfluidics enables rapid fabrication of emulsions, suspensions, and 3D modular (bio)materials. Sci. Adv. 4:eaao1175. DOI:10.1126/sciadv.aao1175 |
| [5] | Deng X., Li H. and Song Y. (2024). Inkjet printing-based high-throughput DNA synthesis. Giant 17:100222. DOI:10.1016/j.giant.2023.100222 |
| Jiang J. and Visser C. (2026). "Drop-printing" enables stress-free conformal wrapping of bioelectronic interfaces. The Innovation Materials 4:100213. https://doi.org/10.59717/j.xinn-mater.2026.100213 |
To request copyright permission to republish or share portions of our works, please visit Copyright Clearance Center's (CCC) Marketplace website at marketplace.copyright.com.
Drop-printing for stress-free wrapping of bioelectronic interfaces