Cooling next-generation electronics: From emerging semiconductors to data centers
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REFERENCES
[1] Bar-Cohen A., Maurer J. J. and Altman D. H. (2019). Embedded cooling for wide bandgap power amplifiers: A review. J. Electron. Packag. 141:040803. DOI:10.1115/1.4043404 [2] van Erp R., Soleimanzadeh R., Nela L., et al. (2020) Co-designing electronics with microfluidics for more sustainable cooling. Nature 585:211–216. DOI:10.1038/s41586-020-2666-1 [3] Wu Z.H., Xiao W., He H.Y., et al. (2025). Jet-enhanced manifold microchannels for cooling electronics up to a heat flux of 3,000 W cm−2. Nat. Electron. DOI:10.1038/s41928-025-01449-4 [4] Alissa H., Nick T., Raniwala A., et al. (2025). Using life cycle assessment to drive innovation for sustainable cool clouds. Nature 641:331–338. DOI:10.1038/s41586-025-08832-3 [5] Jiang M.N., Wang Y., Liu F. Y., et al. (2022). Inhibiting the Leidenfrost effect above 1,000 °C for sustained thermal cooling. Nature 601:568−572. DOI:10.1038/s41586-021-04307-3 -
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Wu Z. and Wang Z. (2025). Cooling next-generation electronics: From emerging semiconductors to data centers. The Innovation Energy 2:100125. https://doi.org/10.59717/j.xinn-energy.2025.100125
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Wu Z. and Wang Z. (2025). Cooling next-generation electronics: From emerging semiconductors to data centers. The Innovation Energy 2:100125. https://doi.org/10.59717/j.xinn-energy.2025.100125
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Figure 1.
Thermal management across from chip to rack-level infrastructure
