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The Innovation Materials > 2026 Vol. 4 > No. 3 > 100234
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Warp-knitted glass fiber architectures for chip-scale electromagnetic-thermal-mechanical integration

  • 1.

    Zhejiang Key Laboratory of Magnetic Materials and Applications, Ningbo Institute of Materials Technology and Engineering, CAS, Ningbo 315201, China

  • 2.

    University of Chinese Academy of Sciences, 19 A Yuquan Rd, Shijingshan District, Beijing 100049, China

  • 3.

    Jiujiang Huayuan New Material Co., Ltd, Jiujiang 332000, China

  • 4.

    Max Planck Institute of Microstructure Physics, Halle (Saale) 06120, Germany

More Information
  • Corresponding authors: lmy@cnhynm.com (M.L.);  liguowei@nimte.ac.cn(G.L.)
  • Received Date:  July 08, 2026
    Accepted Date:  July 21, 2026
    Published Online:  July 21, 2026
The Innovation Materials  4(3),  https://doi.org/10.59717/j.xinn-mater.2026.100234  |  Cite this article
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    • REFERENCES
  • [1] Das Sharma D., Pasdast G., Tiagaraj S. et al. (2024). High-performance, power-efficient three-dimensional system-in-package designs with universal chiplet interconnect express. Nat. Electron. 7:244−254. DOI:10.1038/s41928-024-01126-y

    View in Article CrossRef Google Scholar

    [2] Bai Z. and Zhang Q. (2024). Chipless textile electronics enable wireless digital interactions. The Innovation 5:100676. DOI:10.1016/j.xinn.2024.100676

    View in Article CrossRef Google Scholar

    [3] Zhao G., Sui C., Zhao C. et al. (2024). Supertough MXene/sodium alginate composite fiber felts integrated with outstanding electromagnetic interference shielding and heating properties. Nano Lett. 24:8098−8106. DOI:10.1021/acs.nanolett.4c01920

    View in Article CrossRef Google Scholar

    [4] Yang X., Yang Y., Cheng S. et al. (2025). Conformal hexagonal boron nitride encapsulation of graphene-skinned glass fiber fabric for enhanced electrical stability. Nat. Commun. 16:4965. DOI:10.1038/s41467-025-60324-0

    View in Article CrossRef Google Scholar

    [5] Lin G., Shu M., Zhao Q. et al. (2024). Evidence for field induced quantum spin liquid behavior in a spin-1/2 honeycomb magnet. Innov. Mater. 2:100082. DOI:10.59717/j.xinn-mater.2024.100082

    View in Article CrossRef Google Scholar

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  • Cite this article:

    Sun W., Li M., Li J., et al. (2026). Warp-knitted glass fiber architectures for chip-scale electromagnetic-thermal-mechanical integration. The Innovation Materials 4:100234. https://doi.org/10.59717/j.xinn-mater.2026.100234
    Sun W., Li M., Li J., et al. (2026). Warp-knitted glass fiber architectures for chip-scale electromagnetic-thermal-mechanical integration. The Innovation Materials 4:100234. https://doi.org/10.59717/j.xinn-mater.2026.100234

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