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Planar to shape-adaptive electronics: Based on liquid metal circuits printed on thermoplastic films

  • 1.

    School of Integrated Circuits, Hubei University, Wuhan 430062, China

  • 2.

    Yangtze Laboratory, Wuhan 430205, China

  • 3.

    Thermal Science Research Center, Shandong Institute of Advanced Technology, Jinan 250100, China

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  • Author Bio: E-mail: wuxiaohu@pku.org.cn (X.W.)
  • Corresponding author: wuxiaohu@pku.org.cn
  • Received Date:  May 07, 2026
    Accepted Date:  September 02, 2026
    Published Online:  September 02, 2026
The Innovation Materials  https://doi.org/10.59717/j.xinn-mater.2026.100239  |  Cite this article
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    • REFERENCES
  • [1] Kuo F.-C., Chuang S.-H. and Liao Y.-C. (2026). Liquid metal-based solder composite with ultralow reflow temperature for surface mounting on flexible printed circuits. ACS Appl. Electron. Mater. 8:368−377. DOI:10.1021/acsaelm.5c02030

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    [2] Hur O., Zu W., Ho D. H., et al. (2025). Conformal printing of electrically conductive viscous liquid metal on 3D structures. Appl. Mater. Today 47:102938. DOI:10.1016/j.apmt.2025.102938

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    [4] Zhao Z., Soni S., Lee T., et al. (2023). Smart eutectic gallium–indium: From properties to applications. Adv. Mater. 35:2203391. DOI:10.1002/adma.202203391

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    [5] Wang D., Wang X. and Rao W. (2021). Precise regulation of Ga-based liquid metal oxidation. Acc. Mater. Res. 2:1093−1103. DOI:10.1021/accountsmr.1c00173

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  • Cite this article:

    Liu Z., Wu W., Liu S., et al. (2026). Planar to shape-adaptive electronics: Based on liquid metal circuits printed on thermoplastic films. The Innovation Materials 4:100239. https://doi.org/10.59717/j.xinn-mater.2026.100239
    Liu Z., Wu W., Liu S., et al. (2026). Planar to shape-adaptive electronics: Based on liquid metal circuits printed on thermoplastic films. The Innovation Materials 4:100239. https://doi.org/10.59717/j.xinn-mater.2026.100239

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