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The Innovation Energy > 2026 Vol. 3 > No. 2 > 100152
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Laser manufacturing for extreme chip cooling

  • 1.

    School of Mechanical Engineering, Beijing Institute of Technology, Beijing 100081, China

  • 2.

    School of Integrated Circuits, Peking University, Beijing 100871, China

  • 3.

    School of Information Engineering, Minzu University of China, Beijing 100081, China

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  • Corresponding author: andong.wang@bit.edu.cn 
  • Received Date:  March 29, 2026
    Accepted Date:  April 20, 2026
    Published Online:  April 23, 2026
The Innovation Energy  3(2),  https://doi.org/10.59717/j.xinn-energy.2026.100152  |  Cite this article
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  • Cite this article:

    Yang R., Wang A., Yang T., et al. (2026). Laser manufacturing for extreme chip cooling. The Innovation Energy 3:100152. https://doi.org/10.59717/j.xinn-energy.2026.100152
    Yang R., Wang A., Yang T., et al. (2026). Laser manufacturing for extreme chip cooling. The Innovation Energy 3:100152. https://doi.org/10.59717/j.xinn-energy.2026.100152

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