| [1] | Shen F.-C., Huang C.-Y., Lo H.-Y., et al. (2021). Atomic-scale investigation of electromigration with different directions of electron flow into high-density nanotwinned copper through In situ HRTEM. Acta Mater. 219:117250. DOI:10.1016/j.actamat.2021.117250 |
| [2] | Ke X., Ye J., Pan Z., et al. (2019). Ideal maximum strengths and defect-induced softening in nanocrystalline-nanotwinned metals. Nat. Mater. 18:1207−1214. DOI:10.1038/s41563-019-0484-3 |
| [3] | Chang S.-Y., Chu Y.-C., Tu K. N., et al. (2021). Effect of anisotropic grain growth on improving the bonding strength of <111>-oriented nanotwinned copper films. Mater. Sci. Eng.: A 804:140754. DOI:10.1016/j.msea.2021.140754 |
| [4] | Zhan X. and Zhu Z. (2024). In situ epitaxial thickening of wafer-scale, highly oriented nanotwinned Ag on tailored polycrystalline Cu substrates. Acta Mater. 268:119792. DOI:10.1016/j.actamat.2024.119792 |
| Ma J., Lu D., Zhu L., et al. (2025). A fabrication strategy of nanotwinned metals with superior manufacturability and weldability for electronic packaging. The Innovation Materials 3:100161. https://doi.org/10.59717/j.xinn-mater.2025.100161 |
To request copyright permission to republish or share portions of our works, please visit Copyright Clearance Center's (CCC) Marketplace website at marketplace.copyright.com.
Fabrication of NT-Ag via galvanic replacement reaction and its Bonding performance