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Three-Dimensional Boron Nitride Networks in Polymer Composites: Fabrication Strategies and Thermal-Management Applications

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    Fund Project: This work was supported by the National Natural Science Foundation of China (No. 23CAA01015 and 52206217). YT acknowledges the generous support from the National Key Laboratory of Multi–Perch Vehicle Driving Systems (No. QDXT-NY-202407-12). We also thank Dr. Chao Yang from the School of Life Science, Beijing Institute of Technology, for helpful discussions.
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    1. BNNSs are promising insulating fillers for thermal management, yet random dispersion in polymers hinders continuous thermal pathways and limits composite thermal conductivity.

      Strategies to build 3D BN networks via external fields, templates and geometry design, clarifying structure–property relations for phonon transport and interfacial thermal resistance.

      Applications of 3D BN networks in electronics, phase-change storage and radiative cooling, and identifies future directions including responsive materials and data-driven optimization.

  • Boron nitride nanosheets (BNNSs) combine high intrinsic thermal conductivity, electrical insulation, and chemical stability, making them attractive electrically insulating fillers for electronic thermal management applications. However, the random dispersion of BNNSs within polymer matrices severely restricts the effective construction of thermally conductive pathways, resulting in limited thermal conductivity of the resultant composites. A central challenge is to construct continuous thermally conductive networks at relatively low BN loadings while reducing interfacial thermal resistance. To address this issue, this review first introduces two mainstream solutions: multi-dimensional filler hybridization and the construction of three-dimensional (3D) boron nitride (BN) networks. This review focuses on representative strategies for engineering BN-based thermal architectures, including external-field-driven alignment, template-assisted assembly, and geometry-guided structural design, with particular emphasis on the transition from directional alignment to multidirectionally interconnected 3D networks. It elucidates the structure–property relationships governing interfacial thermal resistance modulation and phonon transport enhancement. Furthermore, this review summarizes the recent advances in applications of 3D BN networks in electronic thermal management, phase-change energy storage, and radiative cooling, while also discussing key challenges related to scalability, durability, multifunctional integration, and adaptability to complex operating conditions. Finally, future research directions are discussed, highlighting smart-responsive thermal management materials, multiphysics-coupled design, and data-driven structural optimization, aiming to provide a theoretical foundation and technical guidance for the design and engineering application of next-generation high-performance polymeric thermal management materials.
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  • Cite this article:

    Wang X., Lv Y., Yang T., et al. (2026). Three-Dimensional Boron Nitride Networks in Polymer Composites: Fabrication Strategies and Thermal-Management Applications. Energy Use 2:100065. https://doi.org/10.59717/ipj.energy-use.2026.100065
    Wang X., Lv Y., Yang T., et al. (2026). Three-Dimensional Boron Nitride Networks in Polymer Composites: Fabrication Strategies and Thermal-Management Applications. Energy Use 2:100065. https://doi.org/10.59717/ipj.energy-use.2026.100065

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